W-5600 Base Plating System
- Fully automated, computer controlled Base Plating System
- S&A 250B Network Analyzer Monitor Crystal Measurement System
- Quartz monitor crystal rotates on the same spherical radius as devices being plated for accurate plating control
(Patent No. 6,090,444) - Each mask can be plated to a different thickness in the same deposition cycle
- Mechanical assemblies shielded from plating material and easily removed for cleaning
- Low profile bell jar assembly for easy operator access
- Supports various mask systems
- Substrate heater
- RF plasma bombard
- Plating units: Å, Hz, F2, Å of Si 02
Specifications
| Plating Uniformity: | 2% of plateback typical * |
* Performance based on mask dimensions of not greater than 3 x 4.2″.
System Configuration
- Direct Drive Roughing Pump
- Cryo or Diffusion Pump
- Automatic Mask Flipping Mechanism
- Two Metal, 3 Layer Capability
- Substrate Heater
- S&A 250B Network Analyzer
- Plasma Cleaning
- Light Pole
- Computer Requirements:
- Windows® based System Software
- Printer (optional)
Facility Requirements
| Power: | 380V or 208V 3-PHASE, 7 KVA, 50/60 Hz |
| Inlet Pressure (Air): | 90 – 100 PSIG |
| Inlet Pressure (Nitrogen): | 70 – 100 PSIG |
| Inlet Pressure (Argon/Oxygen 80/20 – plasma cleaning): | 10 PSIG |
| Cryo Pump Water Cooling: | 0.50 GPM @ 60° – 80°F |
| Diffusion Pump Water Cooling: | 0.25 GPM @ 60° – 80°F |
| Dimensions: | W 53 x D 34 x H 67.5 Inches (excluding Cryo Compressor) |
The Roditi International Corporation Ltd is the exclusive European representative of Saunders & Associates, LLC
